Advanced Package Design with Mentor Graphics Xpedition

Advanced Package Design with Mentor Graphics Xpedition

Master IC Package & Substrate Design with Real‑World, Production‑Level Techniques

This intensive 5‑day training course equips engineers with in‑depth skills in semiconductor package and substrate design using Mentor Graphics (Siemens EDA) Xpedition Package Designer, including the VX.2.14 platform and the 2409/2510 updates. Attendees will learn how to implement advanced 2.5D/3D IC package layouts, manage complex design constraints, and perform manufacturing‑ready handoffs — using workflow‑driven practices based on real industry demands rather than academic theory. The curriculum balances core fundamentals with practical, realistic use cases encountered in high‑performance computing, mobile, and heterogeneous integration designs.

By the end of the course, participants will understand not just how to use the tools, but why certain design decisions matter in modern package engineering.

Learning Outcomes

By the end of this course, participants will be able to:

• Navigate and configure the Xpedition Package Designer environment for advanced package design.
• Build and edit package substrate layouts using industry‑standard practices.
• Apply constraint‑driven design rules and manage multi‑die, multi‑stack configurations.
• Perform high‑speed routing, padstack creation, and reuse physical design elements.
• Integrate layout with verification and manufacturing output processes.
• Interpret and leverage updates in VX2.14, 2409, and 2510 releases for optimized workflows.

Prerequisites

To succeed in this course, participants should have:

• Basic PCB/IC packaging knowledge or prior EDA tool experience.
• Familiarity with electronic design data management.
• Understanding of schematic capture and board layout workflows.
• Laptop capable of running Xpedition software as provided by the training host.

Training Outline (.Detailed)

1. Course Setup & Tool Overview

• Xpedition Package Designer Interface
  • Navigation, menus, toolbars, panels
  • Workspace customization
• Overview of IC Packaging Capabilities
  • 2.5D/3D package support
  • Substrate and interposer concepts
• Understanding the VX2.14 / 2409 / 2510 Releases
  • UX/UI enhancements
  • Package design feature improvements
  • New pad entry and physical reuse controls

2. Design Preparation

• Project Setup
  • Creating new package projects
  • Template and technology files
• Constraint Management
  • Defining design rules and constraints
  • Importing constraint sets
• Library Setup
  • Padstacks
  • Cells and materials
  • Part definition and pin mapping

3. Substrate & Die Floorplanning

• 2.5D/3D Stack Configurations
  • Multi‑die placement
  • Die orientation and stacking methods
• Platform Floorplanning Tools
  • Integrated placement optimization
• Cross‑domain design considerations

4. Physical Design & Layout

• Placement Techniques
  • Manual and assisted placement
  • Group and block placement
• Routing Fundamentals
  • Sketch routing vs. automatic routing
  • Differential pair routing
• Physical Reuse & Grouping
  • Physical reuse elements
  • Equivalency and replacement rules

5. Advanced Layout Techniques

• Complex Via Structures
  • Microvia stacking and breakout strategies
• Layer Stackup
  • Defining and editing stackups
  • Layer mapping between sources and targets
• High‑Speed & Signal Integrity Considerations
  • Clock/data group rules
  • Impedance control strategies

6. Verification & Rule Checking

• In‑design DRC & LVS
  • On‑the‑fly rule checking
• Geometry‑Based DRC Essentials
  • Writing and using custom rule sets
• Constraint Verification Approaches

7. Design Integration & Data Management

• EDM Collaboration Workflows
  • Database management and versioning
• Forward/Back Annotation
  • Integrating schematic and layout data
• Team‑based Concurrent Design

8. Outputs & Manufacturing Handoff

• Manufacturing Outputs
  • Gerbers, ODB++, IPC‑2581
• 3D Model Export & Validation
• Package to PCB Integration Outputs

9. Practical Lab Sessions

• Real‑world Package Design Projects
  • Step‑by‑step substrate design
  • Constraint‑driven implementation
• Troubleshooting & Optimization Labs

10. Wrap‑up & Next Steps

• Design Review Best Practices
• Common Pitfalls & Solutions
• Resources for Continued Learning (Mentor/Siemens EDA community)